BS EN 60749-15-2010 半导体器件.机械和气候试验方法.穿孔安装设备的耐焊接温度性
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【英文标准名称】:Semiconductordevices.Mechanicalandclimatictestmethods.Resistancetosolderingtemperatureforthrough-holemounteddevices
【原文标准名称】:半导体器件.机械和气候试验方法.穿孔安装设备的耐焊接温度性
【标准号】:BSEN60749-15-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2011-02-28
【实施或试行日期】:2011-02-28
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Solderingtemperatureresistance;Testing;Trough-holemounting
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardassemblyoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:
【国际标准分类号】:31_080_01
【页数】:10P.;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.穿孔安装设备的耐焊接温度性
【标准号】:BSEN60749-15-2010
【标准状态】:现行
【国别】:英国
【发布日期】:2011-02-28
【实施或试行日期】:2011-02-28
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Solderingtemperatureresistance;Testing;Trough-holemounting
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardassemblyoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:
【国际标准分类号】:31_080_01
【页数】:10P.;A4
【正文语种】:英语
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